FOUP300EX provides clean and secure wafer transport, optimum automation in integration.

 

[Industrial field]

Semiconductor

Performance

FOUP300EX can transport 300mm Wafers securely.

 

[Applications]

  • Front Opening Unified Pod for 300mm Wafers.

Characteristics

  • Outstanding sealing capability to prevent particles and contamination from environment.
  • Prevent particle generation and to maintain dimensional accuracy.
  • Capable of conductivity through top, shell/teeth to bottom and side-rails to dissipate electric charge."

Specifications

  • Main parts of FOUP are made from ESD material.
  • Single molded structure to minimize cleaning drying cycle time.

Option

Conductive Side Rails

Bar Code & RF ID Tag

UV Cut Window & Card Case

Color Option